Belden | BDC - Zinsaufwendungen Für Schuld





Zinsaufwendungen Für Schuld Veränderung Datum
Amphenol USD 207.9M 78.2M 2026-03
Aptiv USD 89M 2M 2026-03
Arrow Electronics USD 29.08B 4.55B 2025-12
Bel Fuse USD 2.89M 737K 2025-12
Belden USD 13.46M 1.9M 2026-03
Broadcom USD 856M 75M 2025-12
Cisco Systems USD 370M 20M 2025-12
Clearfield USD 106K 37K 2025-06
Coherent USD 44.56M 1.34M 2026-03
CommScope USD 153.1M 17.8M 2025-12
Corning USD 92M 1000K 2026-03
Digi International USD 2.22M 83K 2026-03
Dolby Laboratories USD 9.88M 2.55M 2025-12
Ericsson SEK 580M 155M 2025-12
Evertz Tech CAD 281K 339K 2025-12
Fujifilm JPY 863M 429M 2026-03
Fujikura JPY 544M 132M 2025-06
Harmonic USD 1.08M 682K 2026-03
Hexagon AB EUR 44.6M 2.3M 2024-12
Intel USD 283M 1000K 2025-12
Jabil Circuit USD 63M 5M 2025-09
Knowles USD 1.5M 2.22B 2026-03
Littelfuse USD 6.98M 1.3M 2026-03
Microchip Technology USD 55.9M 400K 2025-12
NetApp USD 21M 9M 2025-03
Plexus USD 3.42M 534K 2026-03
Sensata Technologies USD 35.7M 2.02M 2025-12
TE Connectivity USD 32M 2M 2026-03
Tesla USD 92M 7M 2026-03
Texas Instruments USD 141M 0 2026-03
TTM Technologies USD 12.38M 1.98M 2025-12
Vishay Intertechnology USD 9.52M 1.06M 2025-09
Visteon USD 3M 0 2026-03
Volex USD 5.7M 2.27M 2023-12